• Most customers need competent backend services even after the initial process of design, prototyping and manufacture of the chip is complete. Chipsolve has a structured procedure to deliver essential backend services to customers:
  • Best in the industry wafer bumping services, with high speed package services, highly efficient supply management and optimal cycle time.
  • Wide range testing services ranging from logic, memory to mixed-mode.
  • Maximum customer interaction and intervention throughout the supply chain to ensure close compliance with customer requirements.
  • By offering backend services integrated into our portfolio, Chipsolve customers can take advantage of shorter time-to-market, advanced packing services and testing services.